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Foisontech Corporation Co., Limited
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6-Layer HDI mobile phone PCB layout OSP Surface Finishing Board

Foisontech Corporation Co., Limited

6-Layer HDI mobile phone PCB layout OSP Surface Finishing Board

Brand Name : FOISON

Model Number : FSD0002L06666

Certification : ISO9001, ISO14001, ISO/TS16949, SGS, UL, RoHs,OHSAS18000

Place of Origin : Shenzhen,China

MOQ : 1

Price : Negotiable

Payment Terms : T/T, Western Union, L/C

Supply Ability : 300, 000 sqm Per Month

Delivery Time : 5-8 working days

Packaging Details : INNER VACCUM-PACKED WITH OUTER CARDBOARD CARTON

Raw Material : Fr - 4

Layer Count : 6 Layer

Board Thickness : 1.6MM

Copper Thickness : 18 µm

Surface Treatment : OSP

Solder Mask : Green

Board Size : 73 * 64 Mm

Min. Aperture : 0.5MM

Min. Line Trace Width/Space : 3Mil / 3Mil

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6-Layer HDI mobile phone PCB layout OSP Surface Finishing Board

Description

1. Professional manufacturer of PCB and PCB assembly specialized in single-sided PCB, double-sided PCB, multilayer PCB, PCB layout and design and PCB assembly

2. Material Type: FR4,non-halogen material ,Aluminium Base,Cooper Base,high frequency material ,Thick copper foil,94-V0(HB),PI Material,HIGH TG:SL S1000-2,ITEQ:IT180

3. Surface treatment: HAL,Immersion Gold,Immersion Tin,Immersion silver,Gold Finger,OSP,HAL(Immersion Gold,OSP,Immersion silver,Immersion Tin)+Gold Finger

PCB Capability

  High precision prototype PCB bulk production
Max Layers 1-28 layers 1-14 layers
MIN Line width(mil) 3mil 4mil
MIN Line space(mil) 3mil 4mil
Min via (mechanical drilling) Board thickness1.2mm 0.15mm 0.2mm
Board thickness2.5mm 0.2mm 0.3mm
Board thickness2.5mm Aspect Ration13:1 Aspect Ration13:1
Aspect Ration Aspect Ration13:1 Aspect Ration13:1
Board thickness MAX 8mm 7mm
MIN 2 layers:0.2mm;4 layers:0.35mm;6 layers:0.55mm;8 layers:0.7mm;10 layers:0.9mm 2 layers:0.2mm;4 layers:0.4mm;6 layers:0.6mm;8layers:0.8mm
MAX Board size 610*1200mm 610*1200mm
Max copper thickness 0.5-6oz 0.5-6oz

Immersion Gold/

Gold Plated Thickness

Immersion Gold:Au,1—8u”
Gold finger
:Au,1—150u”
Gold Plated
:Au,1—150u”
Nickel Plated
:50—500u”
 
Hole copper thick 25um 1mil 25um 1mil
Tolerance Board thickness Board thickness1.0mm:+/-0.1mm
1.0mm<Board thickness
2.0mm:+/-10%
Board thickness>2.0mm:+/-8%
Board thickness1.0mm:+/-0.1mm
1.0mm<Board thickness
2.0mm:+/-10%
Board thickness>2.0mm:+/-8%
Outline Tolerance 100mm:+/-0.1mm
100<
300mm:+/-0.15mm
>300mm:+/-0.2mm
100mm:+/-0.13mm
100<
300mm:+/-0.15mm
>300mm:+/-0.2mm
Impedance ±10% ±10%
MIN Solder mask bridge  0.08mm  0.10mm
Plugging Vias capability  0.25mm--0.60mm  0.70mm--1.00mm

What We Can Do for You?
6-Layer HDI mobile phone PCB layout OSP Surface Finishing Board
With over 13 years experience, we offer OEM & ODM PCB Layout, PCB Design, PCB manufacturing and PCB Assembly in single-sided PCB Board, double-sided PCB and Multilayer Printed Circuit Board service to our customers, with total production capacity of 300,000 sqm/month.

How to get quick quotation?

6-Layer HDI mobile phone PCB layout OSP Surface Finishing Board

Step 1 Please send us Gerber file with these format: .CAD / .Gerber / .PCB / .DXP / .P-CAD, etc
Step 2 Also please provide us the below details for quick quotation:

Board material: Fr - 4 / CEM - 1 / CEM - 3 / 22F / Fr - 1 / others

Material brand: SY / KB / Rogers (optional)
Material Specification:High Tg / copper based / aluminum based or others (optional)
Board thickness: 0.1 - 6.0 mm
Copper thickness: 0.05 Oz - 8 Oz ( 17 um - 288 um )
Surface Treatment: OSP / ENIG / HASL / Lead Free HASL / Immersion Tin / Immersion Sin
Color of solder mask and silk print: Green / red / blue / black / white / yellow ,etc
Board size and quantity

If you don't have Gerber file, please provide us the imfomation as step 2 or post your PCB Board to us for clone.

SAMPLE:

Board Basic Info - SAMPLE

Board material

Fr - 4

Material brand

KB

Material Specification

Tg 170

Board thickness

1.6 mm

Copper thickness

1 Oz

Surface Treatment

ENIG

Solder mask / Silk print

Green / White

Board size

100 mm * 100 mm

Quantity

10k

Lead Time
6-Layer HDI mobile phone PCB layout OSP Surface Finishing Board
Layer count Sample lead time/workday Batch lead time/workday
1-2L 2 6
4L 5 8
6L 5 9
8L 6 10
10L 8 10
12L 8 12
14L 10 15
16L 10 18
18-40L (Up to difficulty) at least 18 at least 24
P.S. For HDI, Blind/Buried Hole PCB: Regular Lead Time + 3 workdays

PCB Fabrication FAQ?
6-Layer HDI mobile phone PCB layout OSP Surface Finishing Board

Q1: I am used to designing in metric units while the website is specified in imperial units.

A: When requesting an online quote, the quote form can handle mm units as well as inches for dimensions.

Q2: How do I specify internal cutouts/milling in my design?

A: All internal cutouts/slots/milling should be specified on the same layer is the board outline. The the minimum routable slot size is 32 mils. During order time, please state this requirement in the "Special Request" section so that our CAM engineers is aware of it. This is not something we encounter

Q3: What are the available holes sizes?

A: 14 mils to 150 mils - 1 mil increments 150 mils to 200 mils - 5 mil increments above 200 mils - holes would be routed out We only use drills in imperial units. Files submitted in metric units (mm) would be converted to imperial units (mils) and rounded up to the next mil.

Now send us your inquiry, and you will be replied within 8 hours!

Little knowledge - Metal Core PCB

Metal core PCB's are thermal management circuit boards which use a base metal material as the heat dissipater part of the PCB. They are used in high heat generating application like LED lighting in the area of high power LED lighting, Automotive Interior, Exterior Lighting, Parking Garage Lighting, LED spot light etc.

The metal core can be aluminum (aluminum core PCB) and copper (copper core PCB). The most common used aluminum core PCB is the thermal conductivity at 1W/MK and 2W/MK.


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